Mainland China chipmaking capacity set to outpace Taiwan by 2030
The post Mainland China chipmaking capacity set to outpace Taiwan by 2030 appeared on BitcoinEthereumNews.com. Mainland China chipmaking capacity is accelerating, now poised to become the world’s leading semiconductor foundry hub by 2030, and overtaking Taiwan in total capacity, according to the latest projections from Yole Group. Chinese dominance in this field is fueled by the country’s push to manufacture its own tech as U.S. export restrictions continue to ramp up. China’s rapid rise in semiconductor manufacturing Yole Group forecasts that China’s share of global foundry capacity will rise to 30% by 2030, up from 21% in 2024. In contrast, Taiwan, the current leader, held a 23% share last year. China’s foundry expansion has already propelled it past South Korea (19%), Japan (13%), and the U.S. (10%) in capacity rankings. According to the South China Morning Post, the acceleration is fueled by massive state investment in China chipmaking notably through the China Integrated Circuit Industry Investment Fund (“Big Fund”), which has nurtured national champions like SMIC and Hua Hong Semiconductor. In 2024 alone, China’s monthly wafer production jumped 15% year-on-year, with local chipmakers accounting for 15% of global foundry capacity, a figure set to rise substantially by the decade’s end. The construction of new semiconductor fabrication plants, such as Huahong’s 12-inch facility in Wuxi, compounds the scale and speed of China’s manufacturing ramp-up. Geopolitical tensions and Taiwan’s export crackdown China’s doubling down in this area comes at a time of rising geopolitical pressures. Just three weeks ago, Taiwan imposed strict new export controls targeting Chinese firms like Huawei and SMIC, effectively blacklisting them from accessing advanced Taiwanese semiconductor technologies. As CryptoSlate reported, this move aligns Taiwan more closely with U.S. policy and aims to close loopholes exploited by Chinese companies to circumvent existing sanctions. The updated rules require government approval for any high-tech exports to the blacklisted entities, further isolating China’s chip sector from cutting-edge…
The post Mainland China chipmaking capacity set to outpace Taiwan by 2030 appeared on BitcoinEthereumNews.com.
Mainland China chipmaking capacity is accelerating, now poised to become the world’s leading semiconductor foundry hub by 2030, and overtaking Taiwan in total capacity, according to the latest projections from Yole Group. Chinese dominance in this field is fueled by the country’s push to manufacture its own tech as U.S. export restrictions continue to ramp up. China’s rapid rise in semiconductor manufacturing Yole Group forecasts that China’s share of global foundry capacity will rise to 30% by 2030, up from 21% in 2024. In contrast, Taiwan, the current leader, held a 23% share last year. China’s foundry expansion has already propelled it past South Korea (19%), Japan (13%), and the U.S. (10%) in capacity rankings. According to the South China Morning Post, the acceleration is fueled by massive state investment in China chipmaking notably through the China Integrated Circuit Industry Investment Fund (“Big Fund”), which has nurtured national champions like SMIC and Hua Hong Semiconductor. In 2024 alone, China’s monthly wafer production jumped 15% year-on-year, with local chipmakers accounting for 15% of global foundry capacity, a figure set to rise substantially by the decade’s end. The construction of new semiconductor fabrication plants, such as Huahong’s 12-inch facility in Wuxi, compounds the scale and speed of China’s manufacturing ramp-up. Geopolitical tensions and Taiwan’s export crackdown China’s doubling down in this area comes at a time of rising geopolitical pressures. Just three weeks ago, Taiwan imposed strict new export controls targeting Chinese firms like Huawei and SMIC, effectively blacklisting them from accessing advanced Taiwanese semiconductor technologies. As CryptoSlate reported, this move aligns Taiwan more closely with U.S. policy and aims to close loopholes exploited by Chinese companies to circumvent existing sanctions. The updated rules require government approval for any high-tech exports to the blacklisted entities, further isolating China’s chip sector from cutting-edge…
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